New PDF release: 3D Microelectronic Packaging: From Fundamentals to

By Yan Li,Deepak Goyal

ISBN-10: 3319445847

ISBN-13: 9783319445847

This quantity offers a entire reference for graduate scholars and execs in either academia and at the basics, processing information, and functions of 3D microelectronic packaging, an pattern for destiny microelectronic programs. Chapters written by means of specialists conceal the latest study effects and development within the following components: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, complex fabrics, warmth dissipation, thermal administration, thermal mechanical modeling, caliber, reliability, fault isolation, and failure research of 3D microelectronic applications. a number of photos, tables, and didactic schematics are incorporated all through. This crucial quantity equips readers with an in-depth figuring out of all elements of 3D packaging, together with packaging structure, processing, thermal mechanical and moisture similar reliability matters, universal disasters, constructing components, and destiny demanding situations, supplying insights into key parts for destiny examine and development. 

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3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics) by Yan Li,Deepak Goyal


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